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System-In-Package Platforms

• Gene Frantz - Chief Technology Officer for Octavo Systems
  • One of the founders and the visionary behind Octavo Systems
  • Professor in the Practice at Rice University in the Electrical and Computer Engineering Department
  • Was the Principal Technology Fellow at Texas Instruments where he built a career finding new opportunities and building new businesses to leverage TI’s DSP technology
  • Holds 48 patents and has written over 100 papers/articles and presents at conferences around the globe
  • Has a BSEE from the University of Central Florida, a MSEE from Southern Methodist University, and a MBA from Texas Tech University
• Erik Welsh - Applications and Systems Manager for Octavo Systems
  • Has over 16 years of industry experience designing hardware and software systems, including 11 years at Texas Instruments
  • Supported hundreds of developers bringing embedded systems quickly to market
  • Simplifying complex systems is a passion and mentors engineers developing embedded Linux systems
  • Developed platforms for cutting-edge wireless research to provide open-access to startups
  • Began his career as a SoC (System-On-Chip) designer eventually leading SoC Security Architecture development
  • Currently holds multiple patents in the area of System-in-Package technology
  • Has a Bachelor of Science and Masters in Electrical Engineering from Rice University
• Octavo Systems
  • For more background on Octavo Systems check out MEP EP#17: System-in-Package (SiP) Platforms with Greg Sheridan
  • How do System-In-Package devices make designers and engineers lives easier?
  • Certification for FCC and CE? Some modules are pre FCC certified with an ID. Is there a benefit using a System-in-Package to reduce product development risk here?
  • OSD335x C-SIP
  • The Future of SIP

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Tags: electronics podcast, Erik Welsh, Gene Frantz, MacroFab, macrofab engineering podcast, MEP, Octavo Systems, OSD335X C-SIP, System on Chip, System-in-Package