Thermal Trials and Temperature Tales

Published: Jan. 10, 2020, 10:47 a.m.

We all know that today’s engineering teams are facing increasing challenges surrounding thermal aware designs. Whether you are designing a board, an IC, or a system, we all struggle with thermal and electrical simulation at one point or another. In this week’s Fish Fry, Jerry Zhao (Cadence Design Systems) and I discuss the challenges of thermal and electrical simulation and the benefits of electrical and thermal co-simulation of multi-physics designs.