Podcasts Technology Intel CitC Hardware as the Next Innovation Layer: From Optane to FPGA's and Beyond- Intel CitC Episode 141

Hardware as the Next Innovation Layer: From Optane to FPGA's and Beyond- Intel CitC Episode 141

Published: June 6, 2018, 4 p.m.

In this episode of Conversations in the Cloud, Jacob Smith, SVP of engagement and Co-founder of Packet, joins us to discuss the promise of the cloud delivered on bare metal. Jacob and his brother founded Packet in 2014, with the intention of automating fundamental infrastructure. Jacob talks about Packet\u2019s new collaboration with Intel to accelerate adoption of Intel\xae Optane\u2122 SSDs as a data center fast storage and memory solution. Packet will provide on-demand access to the Intel\xae Xeon\xae Scalable platform with large format Intel\xae Optane\u2122 technology at no cost. This will provide an easy way for open source and commercial software projects to benchmark and optimize this cutting edge technology, and unleash new innovations. To learn more about Packet and how you can accelerate with Optane, visit https://www.acceleratewithoptane.com/.